This past Tuesday, MediaTek introduced the Dimensity 8300, which is the company’s most recent processor designed for use in Android handsets. Utilizing TSMC’s cutting-edge second-generation 4nm process technology, this new product boasts a performance enhancement of twenty percent and a reduction in power usage of thirty percent in comparison to its predecessor.
The new chipset that the business has released provides full support for generative artificial intelligence. This support includes large language models (LLMs) and technology such as stable diffusion. On the other hand, the business claims that the chip is capable of supporting up to 320-megapixel cameras and 5G network downlink speeds of up to 5.17Gbps.
The recently introduced Dimensity 8300 mobile CPU is an octa-core chip that features four Arm Cortex-A715 performance cores and four Cortex-A510 efficiency cores. These cores are clocked at 3.35GHz and 2.2GHz, respectively. With support for Multi-Circular Queue (MCQ), it is compatible with LPDDR5x member storage as well as UFS 4 storage.
It has been demonstrated through previous benchmark scores that this processor is capable of competing with Qualcomm’s Snapdragon 8 Gen 2 SoC, which is the company’s second most powerful chip.
In addition to the advancements made to the central processing unit (CPU), the chip also features a graphics processing unit (GPU) called Mali-G615, which is said to consume 55 percent less power while providing 60 percent better performance than the one from the previous year.
According to report, the processor also has MediaTek’s HyperEngine game technology, which controls the temperature of the device and prevents the device from becoming overheated when it is being used for gaming responsibilities.
The Imagiq 980 image signal processor (ISP) that is included in the MediaTek Dimensity 8300 is said to be capable of delivering 4K60 frames per second high dynamic range (HDR) and support for longer video recording times. This is a result of improvements in power consumption. It is compatible with mobile devices that have cameras that have a maximum resolution of 320 megapixels.
MediaTek has fitted the Dimensity 8300 with an APU 780 AI processor that has an architecture that is comparable to that of the more advanced Dimensity 9300 chipset. This has resulted in a performance improvement of two times for INT/FP16 computation and a performance gain of three and a half times for AI performance, respectively.
In the meanwhile, the chipmaker claims that it is capable of supporting on-device generative artificial intelligence technology with up to 10 billion parameters, in addition to providing support for stable diffusion.
When it comes to connectivity, the new Dimensity 8300 is equipped with a 3GPP Release-16 modem that is capable of supporting both 5G and 4G LTE. In addition, the chipset is equipped with support for Wi-Fi 6E and Bluetooth 5.4, as well as support for satellite-based navigation systems such as GPS, GLONASS, and NavIC.
In accordance with MediaTek, 5G mobile devices that are powered by the recently introduced Dimensity 8300 chip are scheduled to be released prior to the year’s conclusion. It is anticipated that the chip would compete with the Snapdragon 8 Gen 2 and Snapdragon 8+ Gen 1 semiconductors manufactured by Qualcomm Systems.
Although particular models that have the MediaTek processor have not yet been disclosed, we can anticipate that smartphone manufacturers will release new models that feature the mobile chipset in the weeks and months to come.